Publicity Co-chairs

Yifei Zhu, Shanghai Jiao Tong University, China

Zongxing Xie, Stony Brook University, USA

Technical Program Committee

Danda B. Rawat, Howard University, Washington DC, USA

Shengzhong Liu, University of Illinois at Urbana-Champaign, USA

Jie Yang, Florida State University, USA

Huajie Shao, College of William and Mary, USA

Kui Wu, University of Victoria, Canada

Kai Bu, Zhejiang University, China

Jia (Kevin) Liu, The Ohio State University, USA

Sharan Naribole, Apple Inc. USA

Xiaowen Chu, The Hong Kong University of Science and Technology (Guangzhou), China

Dan Pei, Tsinghua University, China

Fangxin Wang, The Chinese University of Hong Kong, China

Kaigui Bian, Peking University, China

Edith C. H. Ngai, The University of Hong Kong, China

Dan Wang, The Hong Kong Polytechnic University, China

Hongbo Liu,  University of Electronic Science and Technology of China, China

Hui Cai, Nanjing University of Posts and Telecommunications, China

Kartik Gopalan, Binghamton University (SUNY), USA

Francesco Restuccia, Northeastern University, USA

David Bermbach, TU Berlin & ECDF, Germany

Jie Wu, Temple University, USA

Chuan Wu, The University of Hong Kong, China

Ruiting Zhou, Southeast University, China

Lan Wang, University of Memphis, USA

Beichuan Zhang, The University of Arizona, USA

Fangming Liu, Peng Cheng Laboratory, China

Qingyu Liu, Virginia Tech, USA

Baochun Li, University of Toronto, Canada

Di Niu, University of Alberta, Canada

Qun Li, William & Mary, USA

Qiulin Lin, City University of Hong Kong, China

Guohong Cao, The Pennsylvania State University, USA

Klara Nahrstedt, University of Illinois Urbana-Champaign, USA

Hongwei Zhang, Iowa State University, USA

Jinsong Han, Zhejiang University, China

Abusayeed Saifullah, Wayne State University, USA

Jiahui Hou, University of Science and Technology of China, China

Yaodong Huang, Shenzhen University, China

Wei Wang, HKUST, China

Nakjung Choi, Nokia Bell Labs, USA

Constandinos X. Mavromoustakis, University of Nicosia, Cyprus

Houbing Song, University of Maryland, Baltimore County, USA

Jian Li, SUNY-Binghamton University, USA

Eduardo Cerqueira, Federal University of Para, Brazil

Hongxin Hu, University at Buffalo, USA

Lei Jiao, University of Oregon, USA

Lu Liu, University of Leicester, UK

Miao Pan, University of Houston, USA

Kandaraj Piamrat, Nantes University/LS2N/INRIA, France

Go Hasegawa, Tohoku University, Japan

Michiaki Hayashi, KDDI Corporation, Japan

Li Lu, Zhejiang University, China

Linghe Kong, Shanghai Jiao Tong University, China

Domenico Ciuonzo, University of Naples Federico II, Italy

Hideyuki Shimonishi, Osaka University, Japan

Yanmin Zhu, Shanghai Jiao Tong University, China

Tilman Wolf, University of Massachusetts Amherst, USA

Robert Birke, University of Torino, Italy

Zehua Guo, Beijing Institute of Technology, China

Sangheon Pack, Korea University, South Korea

Patrick P. C. Lee, The Chinese University of Hong Kong, China

Zhangyu Guan, University at Buffalo, USA

Ruidong Li, Kanazawa University, Japan

Zhi Zhou, Sun Yat-sen University, China

Yuchao Zhang, Beijing University of Posts and Telecommunications, China

Rongxing Lu, University of New Brunswick, Canada

Torsten Braun, University of Bern, Switzerland

Qiao Xiang, Xiamen University, China

Chaocan Xiang, Chongqing University, China

Jia Liu, Nanjing University, China

Jia Liu, The Ohio State University, USA

Shaolei Ren, UC Riverside, USA

Pietro Manzoni, Universitat Politecnica de Valencia, Spain

Zhi Liu, The University of Electro-Communications, Japan

Yi Wang, Southern University of Science and Technology, China

Shigeng Zhang, Central South University, China

Xiaolong Zheng, Beijing University of Posts and Telecommunications, China

Deze Zeng, China University of Geosciences, Wuhan, China

Lin Gu, Huazhong University of Science and Technology, China

Chunxiao Jiang, Tsinghua University, China

Zhenjiang Li, City University of Hong Kong, China

Kaiping Xue, University of Science and Technology of China, China

Simone Silvestri, University of Kentucky, USA

Yuan Wu, University of Macau, China

Keisuke UEHARA, Keio University, Japan

Hiroshi Shigeno, Keio University, Japan

Panlong Yang, University of Science and Technology of China, China

Cigdem Sengul, Brunel University London, UK

Wei Bao, University of Sydney, Australia

David Yau, Singapore University of Technology and Design, Singapore

Ruipeng Gao, Beijing Jiaotong University, China

Daniela Renga, Politecnico di Torino, Italy

Cong WANG, City University of Hong Kong, China

Abderrahim Benslimane, Avignon University, France

Haiyang Wang, University of Minnesota at Duluth, USA

Haipeng Dai, Nanjing University, China

Kasthuri Jayarajah, University of Maryland, Baltimore County, USA

Jiaqi Zheng, Nanjing University, China

Yacine Ghamri-Doudane, La Rochelle University, France

Xiapu Luo, The Hong Kong Polytechnic University, China

Yuben Qu, Nanjing University of Aeronautics and Astronautics, China